A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity-Reference-Cited by-同舟云学术

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A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Published:2012-01-06 Issue:4 Volume:23 Page:045304
ISSN:0957-4484
Container-title:Nanotechnology
language:
Short-container-title:Nanotechnology

Author:

Fu Yifeng,Nabiollahi Nabi,Wang Teng,Wang Shun,Hu Zhili,Carlberg Björn,Zhang Yan,Wang Xiaojing,Liu Johan

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

Link

http://stacks.iop.org/0957-4484/23/i=4/a=045304/pdf

Reference54 articles.

1. Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

2. Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

3. Interconnect limits on gigascale integration (GSI) in the 21st century

4. Interconnect opportunities for gigascale integration

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