Pulse co-deposition of tin-silver alloy from citric acid plating bath for microelectronic applications
Author:
Funder
National Research Foundation
Publisher
IOP Publishing
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/2053-1591/ab512d/pdf
Reference39 articles.
1. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
2. Lead-free Solders in Microelectronics
3. Composite lead-free electronic solders
4. Advances in lead-free electronics soldering
5. Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging
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