Interaction of thermal cycling and electric current on reliability of solder joints in different solder balls
Author:
Publisher
IOP Publishing
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/2053-1591/ab366d/pdf
Reference33 articles.
1. Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life
2. Role of stress triaxiality on performance of solder joints with different geometries
3. Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies
4. Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint
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1. Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling;Journal of Electronic Materials;2023-08-29
2. Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model;Scientific Reports;2023-02-13
3. Nondestructive Inspection and Quantification of Soldering Defects in PCB Using an Autofocusing Digital Holographic Camera;IEEE Transactions on Instrumentation and Measurement;2023
4. Numerical investigation on Sn-rich solder joints failure mode: Effects of the thermomechanical anisotropic performance;Engineering Failure Analysis;2023-01
5. Fatigue performance of Cu/Sn–3.0Ag–0.5Cu/Cu solder joints at different current densities;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
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