Role of stress triaxiality on performance of solder joints with different geometries
Author:
Publisher
IOP Publishing
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/2053-1591/ab1494/pdf
Reference25 articles.
1. Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies
2. Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events
3. Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module
4. A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
5. Effects of Thermo-Mechanical Fatigue and Low Cycle Fatigue Interaction on Performance of Solder Joints
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1. Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing;Frontiers in Materials;2024-09-04
2. Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach;Journal of Electronic Materials;2022-04-26
3. Application of machine learning in rapid analysis of solder joint geometry and type on thermomechanical useful lifetime of electronic components;Mechanics of Advanced Materials and Structures;2021-12-16
4. Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling;Soldering & Surface Mount Technology;2020-11-16
5. A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints;Journal of Manufacturing Processes;2020-06
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