Radio-Frequency Characteristics of Partial Dielectric Removal HR-SOI and TR-SOI Substrates
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
https://iopscience.iop.org/article/10.1088/0256-307X/34/6/068101/pdf
Reference24 articles.
1. Silicon-on-Insulator Technology: Materials to VLSI
2. Fabrication and Characterization of High Resistivity SOI Wafers for RF Applications
3. SiO/sub 2/ interface layer effects on microwave loss of high-resistivity CPW line
4. Attenuation mechanisms of aluminum millimeter-wave coplanar waveguides on silicon
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