Study of citrate gold plating by different pulse modes with and without vibration

Author:

Dai Yue,Wang Qing,Zhang Yongbin,Liu Guangmin,Zhang Lin,Wang Feng

Abstract

Purpose The purpose of this paper is to explore the optimum average current density and pulse width for electrodeposition of gold in citrate electrolyte, and it is verified that the uniformity of film thickness can be effectively improved by periodic pulse reverse electroplating. Design/methodology/approach Apply forward pulse current, forward group pulse current and periodic pulse reverse current to the electrolyte and compare the film quality. High-frequency group pulses are used in both forward and reverse directions of the periodic pulse reverse current. Findings It is verified by experiments that periodic pulse reverse plating is superior to forward pulse plating and forward group pulse plating in terms of particle size, compactness, impurity content and thickness uniformity of the film. Add low-frequency vibration to the cathode under the same pulse electrical parameters as a comparative experiment to prove the beneficial effect of vibration on the allowable limiting current density and plating rate. Originality/value Gold film is often used as the sealing layer of precision parts. Increasing the thickness uniformity and improving the compactness of gold film will help to reduce the size error, improve the subsequent assembly accuracy and increase the service life of wear-resistant layer. Citrate gold plating electrolyte combines the advantages of cyanide electrolyte and cyanide-free electrolyte. Hence, this research focuses on the characteristics of periodic pulse reverse plating in terms of particle size, compactness, impurity content and thickness uniformity of the film and compare it with forward pulse plating and forward group pulse plating.

Publisher

Emerald

Subject

General Materials Science,General Chemical Engineering

Reference13 articles.

1. Reverse pulse electrodeposition of Zn–Ni alloys from a chloride bath;Journal of Alloys and Compounds,2009

2. Pulse and pulse reverse plating – conceptual, advantages and applications;Electrochimica Acta,2008

3. Pulse electroplating of ultra-fine grained Au films with high compressive strength;Electrochemistry Communications,2016

4. Gold coated metal nanostructures grown by glancing angle deposition and pulsed electroplating;Physics Letters A,2018

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