Pulse electroplating of ultra-fine grained Au films with high compressive strength-Reference-Cited by-同舟云学术

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Pulse electroplating of ultra-fine grained Au films with high compressive strength

Published:2016-06 Issue: Volume:67 Page:51-54
ISSN:1388-2481
Container-title:Electrochemistry Communications
language:en
Short-container-title:Electrochemistry Communications

Author:

Chen Chun-Yi,Yoshiba Masaharu,Nagoshi Takashi,Chang Tso-Fu Mark,Yamane Daisuke,Machida Katsuyuki,Masu Kazuya,Sone Masato

Funder

Japan Science and Technology Corporation

Japan Society for the Promotion of Science

Publisher

Elsevier BV

Subject

Electrochemistry

Reference22 articles.

1. Preparation and characterization of electroplated amorphous gold–nickel alloy from electrical contact applications;Togasaki;Electrochim. Acta,2005

2. Electrodeposition of amorphous gold alloy films;Kato;Electrochim. Acta,2007

3. Electrodeposition of amorphous Au–Ni alloy film;Yamachika;Electrochim. Acta,2008

4. Influence of the electrochemical parameters on the properties of electroplated Au–Cu alloys;Brun;J. Electrochem. Soc.,2011

5. Plating technology for electronics packaging;Homma;Electrochim. Acta,2001

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