Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review
Author:
Leong Gan Chong,Classe Francis,Lee Chan Bak,Hashim Uda
Abstract
Purpose
– The purpose of this paper is to provide a systematic review on technical findings and discuss the feasibility and future of gold (Au) wirebonding in microelectronics packaging. It also aims to study and compare the cost, quality and wear-out reliability performance of Au wirebonding with respect to other wire alloys such as copper (Cu) and silver (Ag) wirebonding. This paper discusses the influence of wire type on the long-term reliability tests.
Design/methodology/approach
– Literature reviews are conducted based on cost and wire selections of Au, Cu or Ag wirebonding. Detailed wear-out failure findings and wire selection with cost considerations are presented in this review paper. The future and the status of Au wirebonding in microelectronics packaging are discussed in this paper.
Findings
– This paper briefly reviews selected aspects of the Au ball and other alternative bonding options, focusing on reliability performance, and discusses the future of Au wirebonding in the near future in semiconductor packaging.
Practical implications
– The paper reveals the technical considerations when choosing the wire types for future microelectronics packaging.
Originality/value
– The in-depth technical review and strategies of the selection of wire types (Au, Cu or the latest Ag alloy) in microelectronics packaging are discussed in this paper based on previous literature studies.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference59 articles.
1. Abe, H.
,
Kang, D.C.
,
Yamamoto, T.
,
Yagihashi, T.
,
Endo, Y.
,
Saito, H.
,
Horie, T.
,
Tamate, H.
,
Ejiri, Y.
,
Watanabe, N.
and
Iwasaki, T.
(2012), “Cu wire and Pd-Cu wire package reliability and molding compounds”, 2012 IEEE 62nd Electronic Components and Technology Conference, IEEE, San Diego, CA, pp. 1117-1123. 2. Aoh, J.-N.
and
Chuang, C.-L.
(2004), “Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding”, Journal of Electronic Materials, Vol. 33 No. 4, pp. 300-311. 3. Appelt, B.K.
,
Tseng, A.
,
Chen, C.-H.
and
Lai, Y.-S.
(2011), “Fine pitch copper wire bonding in high volume production”, Microelectronics Reliability, Vol. 51 No. 1, pp. 13-20. 4. Blish, R.C.
,
Li, S.
,
Kinoshita, H.
,
Morgan, S.
,
Myers, A.F.
and
Au, A.
(2007), “Gold – aluminum intermetallic formation kinetics”, IEEE Transactions on Device and Materials Reliability, Vol. 7 No. 1, pp. 51-63. 5. Boettcher, T.
,
Rother, M.
,
Liedtke, S.
,
Ullrich, M.
,
Bollmann, M.
,
Pinkernelle, A.
and
Gruber, D.
, et al. (2010), “On the intermetallic corrosion of Cu-Al wire bonds”, IEEE Electronics Packaging Technology Conference (EPTC), 2010 12th, Singapore, pp. 585-590.
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
|
|