Author:
Zhang Yunfan,Wu Kangkang,Li Hui,Shen Shengnan,Cao Wan,Li Feng,Han Jinzhe
Funder
Natural Science Foundation of Hubei Province
National Key Research and Development Program of China
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Recent developments in MEMS sensors: a review of applications, markets and technologies;Bogue;Sensor Rev.,2013
2. MEMS piezoresistive pressure sensor: a survey;Meti;Int.J.Eng.Res.Appl.,2016
3. Overview of automotive sensors;Fleming;IEEE Sensors J.,2001
4. Microsensors for automotive applications-metrology and test;Flik,2001
5. Future and technical considerations of gold wirebonding in semiconductor packaging–a technical review;Gan;Microelectron. Int.,2014
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