Cu wire and Pd-Cu wire package reliability and molding compounds-Reference-Cited by-同舟云学术

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Cu wire and Pd-Cu wire package reliability and molding compounds

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
language:
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Author:

Abe Hidenori,Kang Dong Chul,Yamamoto Takashi,Yagihashi Takashi,Endo Yoshinori,Saito Hiroyuki,Horie Takahiro,Tamate Hironori,Ejiri Yoshinori,Watanabe Naoki,Iwasaki Tomio

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06248975.pdf?arnumber=6248975

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire;Micromachines;2024-07-22

2. Electrochemical characterization of localized corrosion mechanism of ALD Al2O3-coated copper for microelectronic application;Corrosion Science;2024-07

3. Challenge of fabricating difficult-to-nitride materials: Formation of martensitic phase in (Fe0.8Co0.2)8N foil based on industrially suitable gas-nitriding process;AIP Advances;2024-06-01

4. Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review;Journal of Materials Science: Materials in Electronics;2023-10

5. Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging;Micromachines;2023-07-31

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