Author:
Siswanto Waluyo Adi,Borodin Kirill,Mahmoud Zaid Hamid,Surendar A.,Sajjadifar Sami,Abdilova Galiya,Chang Jun
Abstract
Purpose
The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model.
Design/methodology/approach
Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed.
Findings
It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration.
Originality value
It is confirmed.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Cited by
4 articles.
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