Development of an electroless nickel immersion gold process for PCB final finishes-Reference-Cited by-同舟云学术

Development of an electroless nickel immersion gold process for PCB final finishes

Published:2004-09 Issue:3 Volume:30 Page:37-42
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Kwok R.W.M.,Chan K.C.M.,Bayes M.W.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference3 articles.

1. Mallory, G.O. and Hajdu, J.B. (1990), “Electroless plating: fundamentals and applications”, AESF, Orlando, FL, pp. 57‐74 and 118‐124.

2. Mike, W. (2001), “Electroless nickel immersion gold and black pad”, Circuitree, pp. 10‐16.

3. Milad, G. and Martin, J. (2000), “Electroless nickel/immersion gold, solderability and solder joint reliability as functions of process control”, Circuitree, pp. 56‐62.

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