Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films-Reference-Cited by-同舟云学术

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Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films

Published:2015-04-22 Issue:7 Volume:46 Page:3173-3181
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Yu Jin,Kim Kyoungdoc

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-015-2892-6.pdf

Reference29 articles.

1. K. Zeng, R. Stierman, D. Abbott, and M. Murtuza: JOM, 2006, vol. 58, pp. 75-79.

2. B. Houghton and F.D. Bruce: Proceedings of IPC Works 99, Minneapolis, MN, October 1999.

3. F. Cordes and R. Huemoeller: Proceedings of IPC Printed Circuit Expo Conference, Long Beach, CA, March 1999.

4. R. Kwok, K. Chan, and M. Bayes: Circuit world, 2004, vol. 30, pp. 37-42.

5. N. Biunno: Proceedings of Surface Mount Technology International, Edina, MN, October 1999, p. 561.

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2. 2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid as Additives for Electrolytic Ni Plating;Iranian Journal of Science and Technology, Transactions A: Science;2016-10-25

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