Thermal Compression Chip Interconnection Using Organic Solderability Preservative Etched Substrate by Plasma Processing
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Published:2014-12-01
Issue:12
Volume:14
Page:9606-9613
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ISSN:1533-4880
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Container-title:Journal of Nanoscience and Nanotechnology
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language:en
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Short-container-title:j nanosci nanotechnol
Author:
Cho Sung-Won,Choi JoonYoung,Chung Chin-Wook
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering
Cited by
1 articles.
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