Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach

Abstract

Purpose This paper aims to present a reliability performance assessment of electronic packages subjected to harmonic vibration loadings by using a statistical factorial analysis technique. The effects of various geometric parameters, the size and thickness of the printed circuit board and component and solder interconnect dimensions on the fundamental resonant frequency of the assembly and the axial strain of the most critical solder joint were thoroughly investigated. Design/methodology/approach A previously published analytical solution for the problem of electronic assembly vibration was adopted. This solution was modified and used to generate the natural frequency and solder axial strains data for various package geometries. Statistical factorial analysis was used to analyze these data. Findings The results of the present study showed that the reliability of electronic packages under vibration could be significantly enhanced by selecting larger and thicker printed circuit boards and thinner and smaller electrical components. Additionally, taller and thinner solders might also produce better reliability behavior. Originality/value The results of this investigation can be very useful in the design process of electronic products in mechanical vibration environments.