Electrical Behavior of Thin Die Assembly on Flexible Substrate Under Vibration Testing
Author:
Affiliation:
1. Binghamton University,Binghamton,NY,USA
2. Georgia Institute of Technology,Atlanta,GA,USA
Funder
Air Force Research Laboratory
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565270.pdf?arnumber=10565270
Reference20 articles.
1. Flexible Electronics: Thin Silicon Die on Flexible Substrates
2. Flexible Hybrid Electronics: Direct Interfacing of Soft and Hard Electronics for Wearable Health Monitoring
3. Performance Evaluation of RF Novel Microstrip Lines Printed on Flexible Substrates
4. Electromechanical and Thermal Characterization of Printed Liquid Metal Ink on Stretchable Substrate for Soft Robotics Multi-Sensing Applications
5. Evaluation of Electromechanical Performance of A Flexible Hybrid Electronics Temperature Monitor
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