Author:
Chew C.S.,Durairaj R.,Haseeb A. S. M. A.,Beake B.
Abstract
Purpose
– The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. % W film after six times reflows were performed by nanoindentation.
Design/methodology/approach
– The characterization was carried at 25°C, and 100 indents were generated. The elastic modulus and hardness were investigated.
Findings
– The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization.
Originality/value
– There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
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