Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading
Author:
Publisher
Emerald
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Reference8 articles.
1. Constitutive relations for tin-based solder joints
2. Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
3. Engelmaier, W. (1983, “Fatigue life of leadless chip carrier solder joints during power cycling”,IEEE Transactions on CHMT, Vol. 6, pp. 232‐7.
4. Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
5. A fracture mechanics approach to thermal fatigue life prediction of solder joints
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Reliability Evaluation of QFN Devices Soldered Joints with Creep Model;Chinese Journal of Mechanical Engineering;2011
2. Thermal Fatigue Behavior of SnAgCu Soldered Joints in Fine Pitch Devices;Rare Metal Materials and Engineering;2010-03
3. Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments;Journal of Rare Earths;2009-02
4. Mechanical properties of fine pitch devices soldered joints based on creep model;Chinese Journal of Mechanical Engineering (English Edition);2008
5. Review of methods to predict solder joint reliability under thermo-mechanical cycling;Fatigue & Fracture of Engineering Materials and Structures;2007-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3