Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments-Reference-Cited by-同舟云学术

Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments

Published:2009-02 Issue:1 Volume:27 Page:138-144
ISSN:1002-0721
Container-title:Journal of Rare Earths
language:en
Short-container-title:Journal of Rare Earths

Author:

ZHANG Liang,XUE Songbai,CHEN Yan,HAN Zongjie,WANG Jianxin,YU Shenglin,LU Fangyan

Publisher

Elsevier BV

Subject

Geochemistry and Petrology,General Chemistry

Reference36 articles.

1. Effect of cerium on wettability and mechanical properties of soldered joints for SnAgCu lead free solder;Xue;Transactions of the China Welding Institution,2005

2. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints;Kim;Journal of Alloys and Compounds,2003

3. Growth behavior of intermetallic compounds on Sn-3.5Ag-0.5Cu/Cu(Ni) interface under thermal-shearing cycling condition;Qi;Rare Metal Materials and Engineering,2007

4. Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages;Vandevelde;Microelectronics Reliability,2007

5. Properties of lead-free solder alloys with rare earth element additions;Wu;Materials Science and Engineering: R: Reports,2004

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