Voiding Mechanisms in SMT-Reference-Cited by-同舟云学术

Voiding Mechanisms in SMT

Published:1993-01 Issue:1 Volume:5 Page:16-21
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Hance W.B.,Lee N.C.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference8 articles.

1. The Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip Carriers

2. Tvergaard, V. 'Material Failure by Void Growth to Coalescence', in 'Advances in Applied Mathematics', Pergamon Press, Vol. 27, pp.83-149(1989).

3. Lau, J. H. and Jeans, A. H. 'Effects of Voids on SMT Solder Joint Reliability', in 'Microelectronic Packaging Technology: Materials and Processes', edited by W. T. Shieh, ASM International,Metal Park, Ohio, pp.177-187 (1989).

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