Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging

Published:2023-07 Issue:7 Volume:13 Page:1058-1063
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Yeo Siang Miang¹^ORCID,Yow Ho-Kwang²^ORCID,Yeoh Keat Hoe²^ORCID

Affiliation:

1. Amkor Technology Inc., Kuala Langat, Selangor, Malaysia

2. Department of Electrical and Electronics Engineering, Lee Kong Chian Faculty of Engineering and Science and the Centre for Photonics and Advanced Material Research, Universiti Tunku Abdul Rahman, Petaling Jaya, Selangor, Malaysia

Funder

Tin Industry (Research and Development) Board, Ministry of Energy and Natural Resources, Kuala Lumpur, Malaysia

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10221737/10176139.pdf?arnumber=10176139

Reference25 articles.

1. Trends of Power Electronic Packaging and Modeling

2. Failure modes and FEM analysis of power electronic packaging

3. Study on solder void for PiP large solder area ultrathin die in solder reflow

4. Semiconductor Power Devices

5. Power electronics technology at the dawn of the new millenium-status and future;vanwyk;IEEE Proc Power Electron Spec Conf (PESC),1999

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP