Ultra-thin TEM Sample Preparation with Advanced Backside FIB Milling Method-Reference-Cited by-同舟云学术

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Ultra-thin TEM Sample Preparation with Advanced Backside FIB Milling Method

Published:2010-07 Issue:S2 Volume:16 Page:170-171
ISSN:1431-9276
Container-title:Microscopy and Microanalysis
language:en
Short-container-title:Microsc Microanal

Author:

Kang H-J,Kim JH,Oh JW,Back TS,Kim HJ

Abstract

Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.

Publisher

Cambridge University Press (CUP)

Subject

Instrumentation

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Critical Discussion of Ex situ and In situ TEM Measurements on Memristive Devices;Springer Series on Bio- and Neurosystems;2023-09-20

2. FIB Overview;Microelectronics Failure Analysis;2019

3. Kinetically Controlled Formation and Decomposition of Metastable [(BiSe)1+δ]m[TiSe2]m Compounds;Journal of the American Chemical Society;2018-02-12

4. Atomistic simulations of focused ion beam machining of strained silicon;Applied Surface Science;2017-09

5. Transmission Electron Microscopy on Memristive Devices: An Overview;Applied Microscopy;2016-12-30

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