Side-by-Side Comparison of Passive MEMS Strain Test Structures under Residual Compression-Reference-Cited by-同舟云学术

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Side-by-Side Comparison of Passive MEMS Strain Test Structures under Residual Compression

Published: Issue: Volume: Page:168-168-33
ISSN:
Container-title:Mechanical Properties of Structural Films
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Author:

Masters ND,de Boer MP,Jensen BD,Baker MS,Koester D

Publisher

ASTM International

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sacrificial Materials and Release Etchants for Metal MEMS That Reduce or Eliminate Hydrogen-Induced Residual Stress Change;Journal of Microelectromechanical Systems;2021-06

2. Residual strain measurement of piezoelectric multilayers by spiral structure;Journal of Mechanical Science and Technology;2012-07

3. Analysis and characterization of a mechanical sensor to monitor stress in interconnect features;Thin Solid Films;2010-10

4. Characteristics of a commercially available silicon-on-insulator MEMS material;Sensors and Actuators A: Physical;2007-07

5. Mechanical Effects of Galvanic Corrosion on Structural Polysilicon;Journal of Microelectromechanical Systems;2007-02

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