Affiliation:
1. Department of Mechanical Engineering , Sanyo-Onoda City University , Daigaku-dori 1-1-1, Sanyo-Onoda , Yamaguchi 756-0884 , Japan
2. Department of Applied Electronics , Tokyo University of Science , 6-3-1 Niijuku, Katsushika-ku , Tokyo 125-8585 , Japan
Abstract
Abstract
Nanostructures have unique characteristics, such as large specific surface areas, that provide a wide range of engineering applications, such as electronics, optics, biotics, and thermal and fluid dynamics. They can be used to downsize many engineering products; therefore, new nanofabrication techniques are strongly needed to meet this demand. A simple fabrication process with high throughput is necessary for low-cost nanostructures. In recent years, three-dimensional (3D) nanostructures have attracted much attention because they dramatically opened up new fields for applications. However, conventional techniques for fabricating 3D nanostructures contain many complex processes, such as multiple patterning lithography, metal deposition, lift-off, etching, and chemical-mechanical polishing. This paper focuses on controlled-acceleration-voltage electron beam lithography (CAV-EBL), which can fabricate 3D nanostructures in one shot. The applications of 3D nanostructures are introduced, and the conventional 3D patterning technique is compared with CAV-EBL and various 3D patterning techniques using CAV-EBL with nanoimprinting technology. Finally, the outlook for next-generation devices that can be fabricated by CAV-EBL is presented.
Subject
Instrumentation,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference85 articles.
1. International Roadmap for Devices and Systems, 2017 Edition, Lithography.
2. C. K. Hu and J. M. E. Harper, Mater. Chem. Phys. 52, 5 (1998).
3. N. Samoto, Y. Makino, K. Onda, E. Mizuki and T. Itoh, J. Vac. Sci. Technol. B 8, 1335 (1990).
4. E. Y. Chang, K. C. Lin, E. H. Liu, C. Y. Chang, T. H. Chen, et al., IEEE Electr. Device Lett. 15, 277 (1994).
5. A. S. Wakita, C.-Y. Su, H. Rohdin, H.-Y. Liu, A. Lee, et al., J. Vac. Sci. Technol. B 13, 2725 (1995).
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献