Influence of heat source size and film thickness on phonon transport in a two-dimensional thin film

Author:

Ali Haider,Yilbas Bekir S.

Abstract

Abstract.Phonon transport in a two-dimensional thin silicon film is considered and the effect of heat source size and the film thickness on the transport characteristics is examined. Frequency dependent Boltzmann equation is incorporated in the analysis to account for the contribution of the ballistic phonons to the energy transport. Equivalent equilibrium temperature is introduced to assess the thermal resistance during the phonon transport in the film. The numerical scheme with the appropriate boundary conditions is used to predict the transport properties, including the effective thermal conductivity, of the thin film. It is found that the heat source size and the film thickness influence the thermal resistance of the film almost equally. The ballistic phonons reduce the film thermal resistance while suppressing the effective thermal conductivity in the thin film.

Funder

Deanship of Scientific Research (DSR)

Publisher

Walter de Gruyter GmbH

Subject

General Physics and Astronomy,General Chemistry

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1. Entropy Generation Rate for Stationary Ballistic-Diffusive Heat Conduction in a Rectangular Flake;Journal of Computational and Theoretical Transport;2021-02-23

2. Thermal Stress Development in Low Dimensional Silicon Film: An Analytical Approach;Journal of Non-Equilibrium Thermodynamics;2021-01-07

3. Three-Dimensional Ballistic-Diffusive Heat Transport in Silicon: Transient Response and Thermal Conductivity;Journal of Non-Equilibrium Thermodynamics;2020-10-25

4. Abnormal thermal boundary resistance of thin films with heat source;International Journal of Heat and Mass Transfer;2020-02

5. Microscale Thermal Energy Transfer Between Thin Films with Vacuum Gap at Interface;Journal of Non-Equilibrium Thermodynamics;2019-04-26

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