Three-Dimensional Ballistic-Diffusive Heat Transport in Silicon: Transient Response and Thermal Conductivity

Author:

Mansoor Saad Bin1,Yilbas Bekir S.1

Affiliation:

1. Mechanical Engineering Department, King Fahd University of Petroleum and Minerals, Dhahran, Kingdom of Saudi Arabia

Abstract

AbstractPhonons are the main contributors to thermal energy transfer in thin films. The size dependence of the thermal transport characteristics alters the film properties such as thermal conductivity. Hence, in the present study, three-dimensional, transient phonon transport in dielectric material is studied through the Equation of Phonon Radiative Transport (EPRT) to assess the size dependence of thermal conductivity. The numerical scheme is introduced solving the EPRT in three dimensions and the governing algorithm is described in detail. A parametric study is carried out examining the effect of the \mathrm{Kn} number on the thermal energy transport characteristics in three-dimensional thermally excited film. The formulation and estimation of the effective thermal conductivity tensor is presented and discussed, thereby extending, to some extent, the one-dimensional results obtained earlier. We demonstrate that thermal conductivity changes in all directions, depending on the size effect. In addition, the directions of the temperature gradient and heat flux vectors differ as the \mathrm{Kn} number approaches unity.

Funder

King Fahd University of Petroleum and Minerals

Publisher

Walter de Gruyter GmbH

Subject

General Physics and Astronomy,General Chemistry

Reference48 articles.

1. Thermal conductivity and ballistic phonon transport in cross-plane direction of superlattices;Phys. Rev. B,1998

2. Energy transport across the thin films pair with presence of minute vacuum gap at interface;J. Non-Equilib. Thermodyn.,2016

3. Frequency dependent phonon transport in two-dimensional Silicon and Diamond thin films;Mod. Phys. Lett. B,2012

4. Size and interface effects on thermal conductivity of superlattices and periodic thin-film structures;ASME J. Heat Transfer,1997

5. Microscale thermal energy transfer between thin films with vacuum gap at interface;J. Non-Equilib. Thermodyn.,2019

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