A Study on the Lubrication and Cooling Mechanism of Nano–Silicon Carbide Cutting Fluids for Diamond-Wire Sawing-Reference-Cited by-同舟云学术

A Study on the Lubrication and Cooling Mechanism of Nano–Silicon Carbide Cutting Fluids for Diamond-Wire Sawing

Published:2022-07-20 Issue:5 Volume:65 Page:789-800
ISSN:1040-2004
Container-title:Tribology Transactions
language:en
Short-container-title:Tribology Transactions

Author:

Wang Hongbing¹²,Yao Chunyan¹²,Chen Dongdong¹²,Xu Kaixiang¹²,Sheng Tianwei¹²

Affiliation:

1. College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, P. R. China

2. National International Joint Research Center of Special Purpose Equipment and Advanced Processing Technology, Zhejiang University of Technology, Hangzhou, P. R. China

Publisher

Informa UK Limited

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/10402004.2022.2077272

Reference28 articles.

1. Crystallographic effect on subsurface damage formation in silicon microcutting

2. Wire sawing technology: A state-of-the-art review

3. Diamond Wire Sawing of Solar Silicon Wafers: A Sustainable Manufacturing Alternative to Loose Abrasive Slurry Sawing

4. Next-generation multi-crystalline silicon solar cells: Diamond-wire sawing, nano-texture and high efficiency

5. Fixed Abrasive Diamond Wire Saw Slicing of Single-Crystal Silicon Carbide Wafers

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