A Feasibility Study About Using SiO2Nanofluid Screen Mesh Wick Heat Pipe for Cooling of High-Power LEDs
Author:
Publisher
Informa UK Limited
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1080/01457632.2015.1080519
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1. Thermal effects in packaging high power light emitting diode arrays
2. Measuring the thermal resistance of LED packages in practical circumstances
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5. Dynamic test method for determining the thermal performances of heat pipes
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