A study on the thermal resistance over metal–carbon nanotube interface by molecular dynamics simulation-Reference-Cited by-同舟云学术

A study on the thermal resistance over metal–carbon nanotube interface by molecular dynamics simulation

Published:2022-01-20 Issue:8 Volume:29 Page:899-913
ISSN:0927-6440
Container-title:Composite Interfaces
language:en
Short-container-title:Composite Interfaces

Author:

Zhang Da¹,Tang Yuanzheng¹,Wang Song¹,Lin Han¹,He Yan¹

Affiliation:

1. College of Electromechanical Engineering, Shandong Engineering Laboratory for Preparation and Application of High-performance Carbon Materials, Qingdao University of Science and Technology, Qingdao, China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shandong Province

National Science and Technology Development Project of Shandong Province

Taishan Scholar Project of Shandong Province

Publisher

Informa UK Limited

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Ceramics and Composites

Link

https://www.tandfonline.com/doi/pdf/10.1080/09276440.2021.2024114

Reference38 articles.

1. Study on the interfacial thermal resistance between CNTs and Al with a TTM-MD model

2. A novel MD/FE coupled model for numerical investigation of interfacial thermal resistance in MEMS/NEMS packaging

3. Interface Structure Influence on Thermal Resistance Across Double-Layered Nanofilms

4. Precise control of thermal conductivity at the nanoscale through individual phonon-scattering barriers

5. Measuring the thermal conductivity of individual carbon nanotubes by the Raman shift method

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