Carbon Nanotube Interconnects − A Promising Solution for VLSI Circuits
Author:
Publisher
Informa UK Limited
Subject
General Earth and Planetary Sciences,General Engineering,General Environmental Science
Link
http://www.tandfonline.com/doi/pdf/10.1080/09747338.2016.1158129
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1. Estimating high speed circuit interconnect performance
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3. Alteration of Cu conductivity in the size effect regime
4. Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions
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