Modelling of surfactants and chemistry for electroless Ni-P plating-Reference-Cited by-同舟云学术

Modelling of surfactants and chemistry for electroless Ni-P plating

Published:2017-02-16 Issue:6 Volume:34 Page:454-461
ISSN:0267-0844
Container-title:Surface Engineering
language:en
Short-container-title:Surface Engineering

Author:

Farzaneh Amir¹,Ehteshamzadeh Maryam²,Cobley Andrew J.³

Affiliation:

1. Young Researchers and Elite Club, Karaj Branch, Islamic Azad University, Karaj, Iran

2. Department of Materials Science and Engineering, Faculty of Engineering, Shahid Bahonar University of Kerman, Kerman, Iran

3. The Functional Materials Research Group, Centre for Manufacturing and Materials Engineering, Faculty of Engineering Environment and Computing, Coventry University, Coventry, UK

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/02670844.2017.1287621

Reference31 articles.

1. Electroless plating processes

2. Age hardening of Ni–P–Mo electroless deposit

3. Effects of Y3+on properties of electroless NiYP coatings

4. Electrochemical and structural properties of electroless Ni-P-SiC nanocomposite coatings

5. Effects of SiC particles size on electrochemical properties of electroless Ni-P-SiC nanocomposite coatings

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