Surface metallization with Ni–Cu bimetal for ZTA by electroless plating-Reference-Cited by-同舟云学术

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Surface metallization with Ni–Cu bimetal for ZTA by electroless plating

Published:2021-04-26 Issue:2 Volume:29 Page:161-174
ISSN:0927-6440
Container-title:Composite Interfaces
language:en
Short-container-title:Composite Interfaces

Author:

He Han¹²,Jiang Yehua¹²,Ru Juanjian³,Zhou Rong¹²,Hua Yixin³

Affiliation:

1. School of Material Science and Engineering, Kunming University of Science and Technology, Kunming, PR China

2. National & Local Joint Engineering Laboratory of Advanced Metal Solidification Forming and Equipment Technology, Kunming, PR China

3. Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming, PR China

Funder

National Natural Science Foundation of China

Publisher

Informa UK Limited

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Ceramics and Composites

Link

https://www.tandfonline.com/doi/pdf/10.1080/09276440.2021.1913899

Reference32 articles.

1. Strengthening mechanism and metal/ceramic bonding interface of cold sprayed TiNp/Al5356 deposits

2. A review on synthesis of zirconia toughened alumina (ZTA) for cutting tool applications

3. A method for the calculation of interfacial energies in Al2O3 and ZrO2/liquid-metal and liquid-alloy systems

4. Adhesion at metal–ZrO2 interfaces

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