Improved uniformity of Ni/Au coating on circuits by electroless plating-Reference-Cited by-同舟云学术

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Improved uniformity of Ni/Au coating on circuits by electroless plating

Published:2018-11-28 Issue:10 Volume:35 Page:913-918
ISSN:0267-0844
Container-title:Surface Engineering
language:en
Short-container-title:Surface Engineering

Author:

Liu Dongguang¹²,Tian Heng³,Lin Lijing²,Shi Wenchao¹

Affiliation:

1. Institute of Industry and Equipment Technology, Hefei University of Technology, Hefei, People’s Republic of China

2. School of Materials Science and Engineering, Hefei University of Technology, Hefei, People’s Republic of China

3. Department of Chemical and Chemical Engineering, Hefei Normal University, Hefei, People’s Republic of China

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/02670844.2018.1548537

Reference21 articles.

1. Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

2. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

3. Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni–P plating;Journal of Applied Electrochemistry;2024-07-22

2. Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating;2024-04-24

3. Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection;ACS Applied Electronic Materials;2022-10-04

4. A novel strategy for designable alloy coatings in electroless plating;Transactions of the IMF;2022-08-16

5. Superparamagnetic SiO2@Fe3O4 core/shell fabrication via low-temperature electroless deposition;Materials Chemistry and Physics;2022-02

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