Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/10/2/137/pdf
Reference29 articles.
1. Atmospheric Corrosion;Leygraf,2000
2. Effect of Ag on oxidation of Cu-base leadframe
3. Surface failure analysis of a field-exposed copper-clad plate in a marine environment with industrial pollution
4. Copper patinas formed in the atmosphere—I. Introduction
5. Reactions of copper patina compounds—I. Influence of some air pollutants
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