Review of the wettability of solder with a wetting balance test for recent advanced microelectronic packaging-Reference-Cited by-同舟云学术

Review of the wettability of solder with a wetting balance test for recent advanced microelectronic packaging

Published:2018-12-05 Issue:4 Volume:44 Page:324-343
ISSN:1040-8436
Container-title:Critical Reviews in Solid State and Materials Sciences
language:en
Short-container-title:Critical Reviews in Solid State and Materials Sciences

Author:

Jung Do-Hyun¹,Jung Jae-Pil¹

Affiliation:

1. Department of Materials Science and Engineering, University of Seoul, Seoul, Korea

Funder

the Ministry of Trade, Industry & Energy, Republic of Korea

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Physical and Theoretical Chemistry,Condensed Matter Physics,General Chemical Engineering,Electronic, Optical and Magnetic Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/10408436.2018.1490249

Reference122 articles.

1. Lead-free Solders in Microelectronics

2. Fluxless wetting properties of UBM-coated Si-wafer to Sn-3.5wt%Ag solder

3. Fluxless wetting propeities of one-side-coated under bump metallurgy and top surface metallurgy

4. Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer

5. A review of soft errors and the low α-solder bumping process in 3-D packaging technology

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