A review of soft errors and the low α-solder bumping process in 3-D packaging technology-Reference-Cited by-同舟云学术

A review of soft errors and the low α-solder bumping process in 3-D packaging technology

Published:2017-07-28 Issue:1 Volume:53 Page:47-65
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Jung D. H.^ORCID,Sharma A.^ORCID,Jung J. P.^ORCID

Funder

University of Seoul

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/article/10.1007/s10853-017-1421-y/fulltext.html

Reference89 articles.

1. Jun JH, Kim IR, Jung JP et al (2010) A new non-PRM bumping process by electroplating on Si die for three dimensional packaging. Mater Trans 51:1887–1892

2. Kumar S, Jung DH, Jung JP (2013) High-speed shear test for low α- Sn-1.0%Ag-0.5%Cu (SAC-105) solder ball of sub-100-μm dimension for wafer level packaging. IEEE Trans Compon Pack A3:441–451

3. Baumann RC (2005) Radiation-induced soft errors in advanced semiconductor technologies. IEEE Trans Dev Mater Reliab 5:305–316

4. Ziegler JF, Curtis HW, Muhlfeld HP et al (1996) IBM experiments in soft fails in computer electronics (1978–1994). IBM J Res Dev 40(1):3–18

5. Kumar S, Agarwal S, Jung JP (2013) Soft error issue and importance of low α- solders for microelectronics packaging. Rev Adv Mater Sci 34:185–202

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