Through-Hole Plating Without a Palladium Catalyst
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/00202967.1982.11870614
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Adsorption Promotion of Ag Nanoparticle Using Cationic Surfactants and Polyelectrolytes for Electroless Cu Plating Catalysts;Journal of The Electrochemical Society;2010
2. Ag Nanoparticle Catalyst for Electroless Cu Deposition and Promotion of Its Adsorption onto Epoxy Substrate;Journal of The Electrochemical Society;2008
3. Highly Dispersive Adsorption of Ag Nanoparticle Catalyst for Electroless Copper Plating;Journal of The Surface Finishing Society of Japan;2007
4. Blowholing in PTH Solder Fillets;Circuit World;1986-04-01
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