Ag Nanoparticle Catalyst for Electroless Cu Deposition and Promotion of Its Adsorption onto Epoxy Substrate-Reference-Cited by-同舟云学术

Ag Nanoparticle Catalyst for Electroless Cu Deposition and Promotion of Its Adsorption onto Epoxy Substrate

Published:2008 Issue:5 Volume:155 Page:D377
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Fujiwara Yutaka,Kobayashi Yasuyuki,Kita Koji,Kakehashi Rie,Noro Michio,Katayama Jun-ichi,Otsuka Kuniaki

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. H. Nakahara , inPrinted Circuit Handbook, 6th ed., C. F. Coombs , Editor, Chap. 31, McGraw-Hill, New York (2007).

2. M. Paunovic and M. Schlesinger ,Fundamentals of Electrochemical Deposition, p. 133, John Wiley & Sons, New York (1998).

3. Cationic Polyacrylamide Adsorption on Epoxy Surfaces

4. Through-Hole Plating Without a Palladium Catalyst

5. M. Schlesinger , inModern Electroplating, 4th ed., M. Schlesinger and M. Paunovic , Editors, p. 613, John Wiley & Sons, New York (2000).

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