Highly Dispersive Adsorption of Ag Nanoparticle Catalyst for Electroless Copper Plating
Author:
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Reference18 articles.
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3. 3) J. P. Marton and M. Schlesinger ; J. Electrochem. Soc., 115, 16 (1968).
4. 4) M. Schlesinger ; Modern Electroplating, 4th edition, p. 613 (Wiley, 2000).
5. Synthesis and Characterization of PVP Stabilized Ag/Pd Nanoparticles and Its Potential as an Activator for Electroless Copper Deposition
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3. Ag Nanoparticle Catalyst for Electroless Cu Plating;Journal of The Surface Finishing Society of Japan;2013
4. Adsorption Promotion of Ag Nanoparticle Using Cationic Surfactants and Polyelectrolytes for Electroless Cu Plating Catalysts;Journal of The Electrochemical Society;2010
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