Properties of Ag Nanoparticle Catalyst for Electroless Cu Plating
Author:
Affiliation:
1. Osaka Municipal Technical Research Institute
2. Graduate School of Materials Science, Nara Institute of Science and Technology
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/sfj/66/2/66_48/_pdf
Reference26 articles.
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3. 4) C. Deckert ; ASM Handbook, vol. 5, Surface Engineering, p. 311 (ASM International, 1994).
4. 6) M. Schlesinger ; Modern Electroplating, 5th edition, M. Schlesinger and M. Paunovic, eds., p. 413 (John Wiley and Sons, 2010).
5. 7) A. P. Angelopoulos, J. B. Benziger, S. P. Wesson ; J. Colloid Interface Sci., 185, 147 (1997).
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1. The Latest Trend of the Electroless Plating Catalyst;Journal of The Surface Finishing Society of Japan;2019-09-01
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