The Present and Future Trends in Electroless Copper Plating-Reference-Cited by-同舟云学术

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The Present and Future Trends in Electroless Copper Plating

Published:2007 Issue:2 Volume:58 Page:81-81
ISSN:0915-1869
Container-title:Journal of the Surface Finishing Society of Japan
language:en
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

SHIMIZU Satoru¹

Affiliation:

1. Central Res. Lab., Ebara Udylite Co., Ltd.

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/58/2/58_2_81/_pdf

Reference19 articles.

1. 1) H. Narcus ; Metal Finishing, 45, (9), 64 (1947).

2. 2) S. Wein ; Metal Finishing, 46 (8), 58 (1948).

3. 3) A. E. Cahill ; Proc. Amer. Electroplaters' Soc., 44, 130 (1957).

4. 4) E. B. Saubestre ; Proc. Amer. Electroplaters' Soc., 46, 294 (1959).

5. 5) R. M. Lukes ; Plating, 51, 1066 (1964).

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel Concentration Process for Platinum Group Metals in Automotive Exhaust Catalyst Using Electroless Copper Plating, Sulfurization, and Flotation;Metallurgical and Materials Transactions B;2023-10-30

2. 無電解析出プロセスにおける水の働き;Journal of The Surface Finishing Society of Japan;2022-10-01

3. Electroless Copper Plating Process Applicable to Molded Interconnect Device Using Laser Direct Structuring;Journal of The Surface Finishing Society of Japan;2020-04-01

4. The Surface Finishing Technologies on Printed Wiring Boards;Journal of The Surface Finishing Society of Japan;2017-09-01

5. Tracking a Common Surface-Bound Intermediate during CO2-to-Fuels Catalysis;ACS Central Science;2016-08-08

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