Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass-Reference-Cited by-同舟云学术

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Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass

Published:2014-05-13 Issue:16-18 Volume:95 Page:1967-1981
ISSN:1478-6435
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

Völker B.¹²,Heinz W.¹,Matoy K.³,Roth R.³,Batke J.M.⁴,Schöberl T.⁵,Scheu C.⁶,Dehm G.⁷

Affiliation:

1. KAI – Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Technologiepark Villach, Europastrasse 8, 9524 Villach, Austria

2. Department Materials Physics, University of Leoben, 8700 Leoben, Austria

3. Infineon Technologies AG, 9500 Villach, Austria

4. Infineon Technologies AG, 93049 Regensburg, Germany

5. Erich Schmid Institute of Materials Science of the Austrian Academy of Sciences, Jahnstrasse 12, 8700 Leoben, Austria

6. Department of Chemistry, Ludwig-Maximilians-University, Butenandstrasse 11, 81377 München, Germany

7. Max-Planck-Institut für Eisenforschung GmbH, 40237 Düsseldorf, Germany

Publisher

Informa UK Limited

Subject

Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/14786435.2014.913108

Reference36 articles.

1. Adhesion Measurement of Interfaces in Multilayer Interconnect Structures

2. Adhesion and debonding of multi-layer thin film structures

3. Adhesion measurement of thin films on glass substrates

4. Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

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1. Interfacial Delamination at Multilayer Thin Films in Semiconductor Devices;ACS Omega;2022-07-14

2. Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.;Materials & Design;2021-02

3. Towards quantifying the shear delamination of thin films;Materialia;2019-12

4. Scratch induced thin film buckling for quantitative adhesion measurements;Materials & Design;2018-10

5. Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers;Surface and Coatings Technology;2017-12

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