Monitoring of Condition of Deposited Film Causing Particles in Plasma Etching by Using Practical Load Impedance Monitoring Method-Reference-Cited by-同舟云学术

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Monitoring of Condition of Deposited Film Causing Particles in Plasma Etching by Using Practical Load Impedance Monitoring Method

Published:2016 Issue:10 Volume:59 Page:270-275
ISSN:1882-2398
Container-title:Journal of the Vacuum Society of Japan
language:en
Short-container-title:J. Vac. Soc. Jpn.

Author:

KASASHIMA Yuji¹,UESUGI Fumihiko¹

Affiliation:

1. Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology (AIST)

Publisher

The Vacuum Society of Japan

Subject

Spectroscopy,Surfaces and Interfaces,Instrumentation,General Materials Science

Link

https://www.jstage.jst.go.jp/article/jvsj2/59/10/59_16-RA-027/_pdf

Reference32 articles.

1. 1) N. Ito, T. Moriya, F. Uesugi, M. Matsumoto, S. Liu and Y. Kitayama: Jpn. J. Appl. Phys., 47 (2008) 3630.

2. 2) F. Uesugi, N. Ito, T. Moriya, H. Doi, S. Sakamoto and Y. Hayashi: J. Vac. Sci. Technol. A, 16 (1998) 1189.

3. 3) N. Ito, T. Moriya, F. Uesugi, H. Doi, S. Sakamoto and Y. Hayashi: J. Vac. Sci. Technol. B, 16 (1998) 3339.

4. 4) T. Moriya, N. Ito, F. Uesugi, Y. Hayashi and K. Okamura: J. Vac. Sci. Technol. A, 18 (2000) 1282.

5. 5) T. Moriya, N. Ito and F. Uesugi: J. Vac. Sci. Technol. B, 22 (2004) 2359.

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