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Image Electronics Information Sensing

Published:2018 Issue:7 Volume:72 Page:537-550
ISSN:1342-6907
Container-title:The Journal of The Institute of Image Information and Television Engineers
language:en
Short-container-title:Eizo Joho Media Gakkaishi

Author:

Hamamoto Takayuki¹,Ohtaka Toshinori²,Ikebe Masayuki³,Taruki Hisayuki⁴,Kobayashi Masahiro⁵,Kuroda Rihito⁶,Komuro Takashi⁷,Tokuda Takashi⁸,Funatsu Ryohei⁹,Kondo Toru¹⁰,Hirose Yutaka¹¹,Fujisawa Daisuke¹²,Yamamoto Hiroo¹³

Affiliation:

1. Faculty of Engineering, Tokyo University of Science

2. Brillnics Japan Inc

3. Graduate School of Information Science and Technology, Hokkaido University

4. Toshiba Electronic Devices & Storage Corporation

5. Canon Inc.

6. Graduate School of Engineering, Tohoku University

7. Graduate School of Science and Engineering, Saitama University

8. Graduate School of Science and Technology, Nara Institute of Science and Technology

9. Science and Technology Research Laboratories, NHK

10. Olympus Corporation

11. Panasonic Corporation

12. Mitsubishi Electric Corporation

13. Hamamatsu Photonics K.K.

Publisher

Institute of Image Information and Television Engineers

Subject

Electrical and Electronic Engineering,Computer Science Applications,Media Technology

Link

https://www.jstage.jst.go.jp/article/itej/72/7/72_537/_pdf

Reference147 articles.

1. 1）Y. Kagawa, et al.: “An Advanced CuCu Hybrid Bonding for Novel Stacked CMOS Image Sensor”, IISW （June 2017）

2. 2）Y. Kagawa, et al.: “Novel Stacked CMOS Image Sensor with Advanced Cu2Cu Hybrid Bonding”, IEEE IEDM, pp.8.4.1-8.4.4（Dec.2016）

3. 3）H. Tsugawa, et al.: “Pixel/DRAM/logic 3-layer stacked CMOS image sensor technology”, IEEE IEDM, pp.3.2.1-3.2.4（Dec. 2017）

4. 4）Y. Oike, et al.: “8.3 M-Pixel 480- fps Global-Shutter CMOS Image Sensor with Gain-Adaptive Column ADCs and Chip-on-Chip Stacked Integration”, IEEE J. Solid-State Circuits, 52, 4, pp.985-993（Apr.2017）

5. 5）T. Takahashi, et al.: “A 4.1Mpix 280 fps Stacked CMOS Image Sensor with Array-Parallel ADC Architecture for Region Control”, 2017 Symposium on VLSI Circuits, C19-1, pp. C244-245（2017）

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