Author:
Li Weiping,Cao Xin,Lin Haodong,Tang Zong-Xi
Publisher
The Electromagnetics Academy
Subject
Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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1. Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer;Microelectronics Journal;2024-10
2. An inter-dıgıtal band-pass fılter wıth dual vıas in resonator and defects in ground sheet for S-band applıcatıons;CHEMISTRY BEYOND BORDERS: INTERNATIONAL CONFERENCE ON PHYSICAL CHEMISTRY: The 1st Annual Meeting of the Physical Chemistry Division of the Indonesian Chemical Society;2023
3. Design & Implementation of Microstrip Interdigital Band-Pass Filter for X-Band Applications;2022 IEEE 3rd Global Conference for Advancement in Technology (GCAT);2022-10-07
4. Through Glass Via (TGV) Based Microstrip Interdigital Bandpass Filters;2022 IEEE 5th International Conference on Electronics Technology (ICET);2022-05-13