Through Glass Via (TGV) Based Microstrip Interdigital Bandpass Filters
Author:
Affiliation:
1. University of Electronic Science and Technology of China,School of Electronic Science and Engineering,Chengdu,China,610054
2. Chengdu Micro-Technology Co. Ltd,Chengdu,China,611731
Funder
Fundamental Research Funds for the Central Universities
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9823394/9823964/09825216.pdf?arnumber=9825216
Reference13 articles.
1. A broadband microstrip-to-CPW transition;chen;2005 Asia-Pacific Microwave Conference Proceedings,2005
2. Design of asymmetrical coupled line interdigital filter for long term evaluation (LTE)-26 band
3. A Tunable X-Band Band-Pass Filter Module Using YIG/GGG Layer on RT/Duroid Substrate
4. Cu/Co metaconductor based high signal integrity transmission lines for millimeter wave applications
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