Role of dislocations on Sn diffusion during low temperature annealing of GeSn layers

Author:

Stanchu Hryhorii1,Said Abdulla2,Olorunsola Oluwatobi34,Acharya Sudip23,Amoah Sylvester3,Zamani-Alavijeh Mohammad5ORCID,de Oliveira Fernando M.1ORCID,Chhetri Santosh Karki5,Hu Jin15ORCID,Mazur Yuriy I.1ORCID,Yu Shui-Qing3ORCID,Salamo Gregory1ORCID

Affiliation:

1. Institute for Nanoscience and Engineering, University of Arkansas 1 , Fayetteville, Arkansas 72701

2. Material Science and Engineering Program, University of Arkansas 2 , Fayetteville, Arkansas 72701

3. Department of Electrical Engineering, University of Arkansas 3 , Fayetteville, Arkansas 72701

4. Microelectronics-Photonics Program, University of Arkansas 4 , Fayetteville, Arkansas 72701

5. Department of Physics, University of Arkansas 5 , Fayetteville, Arkansas 72701

Abstract

A study of the mechanism of Sn out-diffusion was performed by annealing Ge0.905Sn0.095 layers at 300 °C. The changes in Sn composition and strain state were confirmed by x-ray diffraction and photoluminescence spectroscopy. Surface defects, appearing as Sn particles, with the highest density of 3.5 × 108 cm−2 were detected by atomic force microscopy after annealing for 2 h. The strain in the GeSn layer stabilized for more prolonged annealing, while the density of particles decreased and their size increased. Annealing results are discussed in terms of Sn segregation and subsequent diffusion along dislocation lines, enhanced out-diffusion by dislocations migration, and surface particle coalescence.

Funder

Air Force Office of Scientific Research

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

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