Effect of copper barrier dielectric deposition process on characterization of copper interconnect-Reference-Cited by-同舟云学术

Effect of copper barrier dielectric deposition process on characterization of copper interconnect

Published:2010-05 Issue:3 Volume:28 Page:567-572
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
language:en
Short-container-title:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena

Author:

Cheng Yi-Lung,Chiu Tai-Jung,Wei Bor-Jou,Wang Huan-Jung,Wu Jiung,Wang Ying-Lang

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://avs.scitation.org/doi/pdf/10.1116/1.3425631

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