1. Reliability Challenges of Through-Silicon-Via (TSV) Stacked Memory Chips for 3-D Integration: From Transistors to Packages;H.-Y Son;IEEE International Interconnect Technology Conference,2013
2. A Study of Properties which the Diffusion Barrier Ta and IMD (Inter-Metal Dielectric) Meterial SiOCH for Cu Ion Diffusion;J W Kim;Proceedings of the KIEE Conference,2004
3. Invasion Percolation Model for Abnormal TDDB Characteristic of ULK Dielectrics with Cu Internconnect at Advanced Technology Nodes;F Chen;International Reliability Physics Symposium,2011