Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier-Reference-Cited by-同舟云学术

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Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier

Published:2015-09 Issue:5 Volume:33 Page:05E111
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Kim Hyunjung,Park Jingyu,Jeon Heeyoung,Jang Woochool,Jeon Hyeongtag,Yuh Junhan¹

Affiliation:

1. Global Technology Center, POSCO, Seoul 135-777, South Korea

Funder

National Research Foundation of Korea (NRF)

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.4922936

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Atomic layer deposition of MoN_x thin films using a newly synthesized liquid Mo precursor;Journal of Vacuum Science & Technology A;2022-12

2. Tungsten Carbides;Ultra-High Temperature Materials IV;2022

3. Mixed‐Anion Compounds: An Unexplored Playground for ALD Fabrication;Advanced Materials Interfaces;2021-05-06

4. Atomic layer deposition of titanium dioxide films using a metal organic precursor (C12H23N3Ti) and H2O (DI water);Journal of Alloys and Compounds;2021-03

5. Plasma-Enhanced Atomic Layer Deposition of Low Resistivity and Ultrathin Manganese Oxynitride Films with Excellent Resistance to Copper Diffusion;ACS Applied Electronic Materials;2020-05-21

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